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The nature of the substrate itself in terms of topography and surface features must also be considered. Is the photoresist required to cover or tent plated through holes or tooling features, and must it conform to existing circuitry This consideration will dictate if dry-film or liquid photoresists are appropriate and, in some instances, the required tone. The required product feature dimensions are equally important. They are usually specified in terms of line width and spacing with a given allowable variation. Since these product specifications are for the final conductor features, the impact of photoresist processing on the critical dimensions must be established. Each photoresist has an inherent contrast (i.e., the rate of change of solubility on exposure to light). This contrast, combined with the resist thickness, phototool, light source used for exposure, and developing conditions, determines the finest feature that can be imaged. For photoresists used in the PWB industry, the minimum line width achievable in production is usually 10 to 25 mm greater than the photoresist thickness. Novel process sequences have demonstrated it is possible to overcome this traditional barrier.2 The adhesion of the photoresist is another key attribute. The chosen photoresist must have good adhesion to the underlying substrate during pattern transfer but must also be able to release cleanly from the substrate during stripping.

Dry-film photoresists are generally used for pattern formation prior to both plating and etching. These films have a three-layer structure, with the photosensitive material sandwiched between a polyester coversheet and a polyethylene separator sheet (see Fig. 26.4). The photoresist thickness is typically 25 to 50 mm, but thinner and thicker films are used for special applications. The photoresist is applied to the printed wiring board (PWB) substrate using lamination: The polyethylene separator is removed, and the photoresist flows under the heat and pressure from the laminating rolls to adhere to the substrate. The polyester coversheet

FIGURE 26.4 Dry-film photoresist components. (Reprinted with permission of DuPont Electronics, DuPont Technical Literature.)

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performs several key functions. It protects the photoresist during handling, prevents sticking to the phototool during contact printing, and acts as an oxygen barrier during exposure. The optical properties of this polyester coversheet are important, especially for producing features less than 100 mm. Dry-film manufacturers have increased the optical clarity and reduced the thickness of the polyester sheet to achieve the required image quality. Thin dry films of 25 mm thickness and less generally use this high-quality coversheet. The chemical and mechanical properties of dry-film photoresists have been tailored to withstand various plating solutions and acid or ammoniacal-etching solutions. They can be grouped in terms of the processing chemistry used to develop the image:

.

Aqueous-developable This group is the industry standard. Semiaqueous-developable These are used in special applications. Solvent-developable This is the original system (see Table 26.1). Since solvent development used chlorinated hydrocarbons, use of the solvent-developable photoresists has generally been abandoned.

TABLE 26.1 Summary for Dry-Film Photoresist Types and Chemistries Photoresist type Aqueous-processable Develop solution Sodium/potassium carbonate Strip solution Sodium/potassium hydroxide Application Acidic solution: etching, plating Limited alkaline solutions: alkaline etch Alkaline solutions: etching, precious metal plating Strong alkaline: full-build electroless Cu plating

The STATUS register is not stored by the machine during an interrupt operation. The instruction in an interrupt routine can modify the STATUS flag bits, and so the user program must store and retrieve the STATUS register during an interrupt.

Chemical Composition Overview Dry-film photoresists vary in their exact chemical compositions, but all contain the following components:3

Polymer backbone Photoactive compound Monomer Dye Additives The polymer backbone sets the fundamental solubility and chemical resistance of the system.

On exposure, the photoactive compound absorbs light of the appropriate wavelength and subsequently reacts with the monomer to alter the solubility of the film in exposed areas. The dye changes color on exposure to provide a visible latent image of the master pattern in the film, referred to as the printout image. Although the printout image decreases the efficiency of the desired photoreaction by consuming a portion of the exposed photoactive compound, it has proven to be a valuable manufacturing aid and is used in almost all dry-film photoresists.

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